Food Packaging Flash Measurement

Yes, and it is standard capability rather than a paid add-on. The host software provides multiple interfaces: TCP sockets, Modbus TCP and discrete I/O handshaking for PLCs, and REST APIs or direct database access for MES, ERP and QMS. Work orders, serial numbers, measurement results, verdicts and reject reasons can all be exchanged bidirectionally. The process is: agree on the interface and field mapping, commission in a test environment, validate with real work orders, then switch over on site. If the counterpart system only supports file exchange (CSV/XML), polling a shared folder is also supported.

We support both shop-floor and IT-level integration. Shop floor: custom TCP socket messages, Modbus TCP (configurable master or slave), discrete I/O handshaking and serial ports (RS232/RS485). System level: RESTful APIs with JSON, direct database access, shared-folder file exchange (CSV/XML) and WebSocket real-time push. If your line uses fieldbuses such as OPC UA or PROFINET, these can be connected through a gateway or middleware, and we provide interface documentation to assist. All interfaces are configuration-driven, so no separate software build is needed per protocol.

A complete traceability chain runs from part to work order to measured values to verdict to disposition. In practice the equipment records a timestamp, work order, serial number or barcode, each measured value and the verdict for every part into a local database, then pushes them to ERP/QMS via REST API or database integration using an agreed field mapping. Rejected parts carry a reject code and image evidence for later root-cause analysis. Historical data can be exported by work order, time range, batch or defect type for SPC analysis and customer-complaint investigation. Field mappings are configurable, so no code change is needed per customer system.

Vision applications on new-energy lines cluster around four stages: appearance inspection of cells and electrodes for scratches, coating loss, burrs and tab misalignment, which places the highest demand on imaging and detection rates; dimensional measurement such as electrode width, alignment and stacking offset; assembly guidance and positioning, working with robots for picking, laminating and assembly verification; and character and barcode recognition before end-of-line for full lifecycle traceability. Compared with 3C electronics, new-energy lines generally run faster takt, larger formats and stricter traceability, so line-scan imaging, multi-station parallelism and tight MES coupling are common. Start by defining the target station and defect list, then validate lighting and algorithms.

Yes, and solutions are organized by industry scenario rather than by product model. Current coverage includes 3C electronics and semiconductors (dimensional and appearance inspection of connectors, structural parts and lead frames), automotive parts (dimensional and assembly verification of stampings, fasteners and seals), precision hardware and medical devices (high-volume small-part inspection with traceability), new energy (electrode and cell inspection), and logistics and medical packaging (sorting, carton-verification and barcode traceability). Each industry solution addresses four questions: what to inspect, with which equipment, how to connect to the line, and how to trace. Tell us your industry and target station for the matching solution page and cases.